The synthesis of abrasive particles with controlled microstructure and the modulation of polishing slurry are key topics in the field of chemical mechanical polishing ( CMP). Any breakthrough in CMP technology could significantly promote the development of super-large-scale integration circuits and ultra-high precision optical devices. 抛光粒子的微结构控制合成及抛光浆料的调配是化学机械抛光(CMP)领域的研究热点,其技术突破直接促进到超大规模集成电路和许多高精度光学器械的发展。